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Automatic Module Bonding Machine

It is mainly used for positioning and soldering of IGBT module substrate,PIN and base plate , and can mount DBC, solder tab and PIN to the base plate by Visual guidance

Equipment Features

• The application of flying Photography Technology 

  improves the speed,UPH(for single material)>450pcs

• Integratable pin modules, UPH(pin insertion)≥2000pcs

• Linear motor, repetition accuracy≤士0.01mm

• Motion part of equipment placed on marble surface can 

  provide stable environment for products assembly

• Meet protocols such as SECS/GEM

• It can interact with the whole factory system for data, and 

  the product status can be browsed in real time, and the 

  data can be traced


Applicable Products

HPD、Econo, etc. 

Technical Specifications
Dimension (L×W×H)5754x2245x2200mm(the front of the reflow oven)
3250x2140x2200m(the back of the reflow oven)
UPHUPH(for single material)>450pcs
UPH(pin insertion)≥2000pcs
Assembly accuracy≤±0.08mm
Repetition accuracy≤士0.01mm
Visual guidance accuracy≤±0.05mm
DBC loadingSupport three DBCs to load the patch at the same time
Track height950±20mm (customizable)
Automatic quick change Quick change system for suction head
Compressed air 0.6-0.7Mpa
Loading/unloading methodMagazine, tray
Material placement carrier

Tray(Base plate, DBC), 

magazie(positioning frame, solder pads),

vibrating plate(an integrated needle loose material )

Operating Voltage / Power

Three-phase 380V±10%, single-phase 220V±10%,

50HZ, TN-S grounding system  / 38KW

The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them. 

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