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Frame Assembly System

This equipment can be used to realize the automation and information construction of the whole process and procedure of automatic loading of side frames and substrates, side frame coding, side frame plasma cleaning, glue application, glue application detection, side frame substrate flip assembly, locking screws and module curing

Equipment Features

• Compatible with multiple products,UPH up to 

  180pcs,customizable process flow

• It can interact with the whole factory system for data,

  the product status can be browsed in real time and 

  the data can be traced .

• Match standard communication interfaces

• Compatible with various loading/unloading methods such 

  as AGV, assembly line and manual


Applicable Products

HPD、Econo, Easy, etc. 


Technical Specifications
Dimension(L×W×H)5215mmx1600mmx2000mm(customizable)
Weight4000KG (4 machines)
UPH≥110pcs(HPD),  ≥180pcs(Econo)
Assembly accuracy≤±0.05mm
Track height950±20mm (customizable)
Side frame coding laserUV light
Coding area scope125mm*125mm*42mm
Laser coding offset accuracy±15μm
Laser power3W/40KHZ (2.5W output at the engraving point)
Minimum Marking Size2mm*2mm
Dispensing SystemsGlue quantity ±3%
Glue dispensing valveScrew valve
Glue incomingEither 300ml or 5 gallons
Dispense speed Max 400mm/s
Loading/unloading methodMagazine, tray
Material placement carrierTray, blister box
Material transfer methodManual trolley, AGV, conveyor line
CMK≥1.67
Operating voltage / Power220V/380V / 20W

The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them.