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Module Cover Assembly Equipment

It will automatically pick the cover plate coming through blister box and use visual guidance to implement the assembly and press-fit with the module.

During the press-fit process, the pressure value is output, and the pressure value is bound with the product information and uploaded to MES.

The module is tested for PIN after press-fit, to check whether the PIN is skewed during the press-fit process. The modules that have passed the inspection flow through the tray to the next process.

Equipment Features

• It can implement automatic loading/unloading, 

  automatic assembly, and soldering fixture reflow.

• It can interact with the whole factory system for data,

  the product status can be browsed in real time and 

  the data can be traced .

• Match standard communication interfaces

• Compatible with various loading/unloading methods such 

  as AGV, assembly line and manual

• Cover laminating pressure can be set, the laminating 

  process has pressure monitoring to avoid pressing the 

  PIN


Applicable Products

HPD、Econo, etc. 


Technical Specifications
Dimension(L×W×H)1500mmx2000mmx2200mm
Weight700KG
UPH≥80pcs
Repetition accuracy≤±0.05mm
Pressure range0-500N
Cover loading/unloading methodBlister box or magazine
Product loading/unloading methodTray, blister box
Material placement carrierTray
Material transfer methodManual trolley, AGV, conveyor line
Operating voltage / Power220V  / 6KW

The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them.