position：Products / Equipment and production line / Accessory Equipment /
Tray Changer for substrate
• Located in the end of die bonder and soldering machine,
it's used to transfer substrates from last tray to next tray
Tray Changer for base plate
• Located in the end of the module bonder and soldering
machine, it's used to transfer base plates of modules
from last tray to next tray
Equipment Features
• Excellent compatibility and practicability
• Visual recognition inspection, dummy-proof
• Meet protocols such as SECS/GEM
• With QR code reading and binding function
Applicable Products
• L:20-70mm，W:20-70mm（Substrate）
• Base plates of modules ED3、HPD, etc.
| Technical Specifications | |
| Dimension（L×W×H） | 1100mmx1100mmx2000mm |
| Weight | 800KG |
| UPH（Substrate） | ≥300pcs |
| UPH（Base plates of Module） | ED3：≥80pcs HPD：≥60pcs |
| Repetition accuracy | ≤±0.05mm |
| Loading/unloading method | Tray, magazine,etc. |
| Material transfer method | Manual trolley, AGV, conveyor line |
| Operating Voltage | 220V |
| Power | 5KW |
The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them.
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