Mainly used for soldering of electric vacuum devices, semiconductor devices, microelectronic devices, etc. under vacuum environment.
Equipment Features
• AI intelligent control, easy to learn and use: specially
developed temperature control software, built-in AI
intelligent temperature control simulation algorithm
• High quality welding, low cavity rate: 25 minutes rapid
heating, temperature control accuracy ±1°, built-in
vacuum module, vacuum degree 5-10mbar
• The welding process is stable and reliable, with heat
insulation between each heating zone, and the
temperature can be adjusted separately
• Modular design, modular configuration and deployment,
to meet the needs of different welding processes
• With flexible and controllable transmission systems, a
variety of transmission systems are available.
Equipment chain speed: 900~1400mm/min
• It can meet the automated mass production. The process
is stable and efficient, which can avoid product
rewelding or scrap and reduce production costs.
Applicable Products
Electric vacuum devices, semiconductor devices, microelectronic devices, etc.
Technical Specifications | |
Dimension (L×W×H) | 5902mmx1395mmx1605mm |
Heating Zone | Max temperature≥ 350℃ |
PCB Maximum width | ≤505mm ( Automatic width adjustment) |
Temperature control accuracy | ±1.0℃ |
Deviation of plate temperature distribution | ±2.0℃ |
Shipping Speed | 900~1400 mm/min |
Heating up time | Approx.25 minutes |
Vacuum Level | 5 mbar~10 mbar |
Flux Recycling | Low-temperature catalyst decomposition + water-cooled condensation |
The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them.