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Vacuum Reflow Oven

Mainly used for soldering of electric vacuum devices, semiconductor devices, microelectronic devices, etc. under vacuum environment.


Equipment Features

• AI intelligent control, easy to learn and use: specially 

  developed temperature control software, built-in AI 

   intelligent temperature control simulation algorithm

• High quality welding, low cavity rate: 25 minutes rapid 

   heating, temperature control accuracy ±1°, built-in 

   vacuum module, vacuum degree 5-10mbar

• The welding process is stable and reliable, with heat 

   insulation between each heating zone, and the 

   temperature can be adjusted separately

• Modular design, modular configuration and deployment, 

   to meet the needs of different welding processes

• With flexible and controllable transmission systems, a 

   variety of transmission systems are available. 

   Equipment chain speed: 900~1400mm/min

• It can meet the automated mass production. The process 

   is stable and efficient, which can avoid product 

   rewelding or scrap and reduce production costs.


Applicable Products

Electric vacuum devices, semiconductor devices, microelectronic devices, etc.


Technical Specifications
Dimension (L×W×H)5902mmx1395mmx1605mm
Heating ZoneMax temperature≥ 350℃
PCB Maximum width≤505mm   ( Automatic width adjustment)
Temperature control accuracy±1.0℃
Deviation of plate temperature distribution±2.0℃
Shipping Speed900~1400 mm/min
Heating up timeApprox.25 minutes
Vacuum Level5 mbar~10 mbar
Flux RecyclingLow-temperature catalyst decomposition + water-cooled condensation

The product pictures and technical specifications are for reference only, Sharetek reserves the final explanation right of them.