Equipment Features

• High mounting accuracy: mounting position accuracy up to ±10μm@3s; mounting pressure accuracy of ±3g;

• Fast mounting speed: UPH up to 2000pcs

• Flexible compatibility with chips, capacitors, resistors and other materials

• Small footprint and low cost

• Meet the protocols of SECS/GEM, SMEMA, etc. and support MES interfacing

• Modular design allows customers to configure the modules they need according to their process requirements

Applicable Materials

Materials such as Si, GaAs and other wafer/bulk dies, resistors/capacitors, etc.

Dispensing & Dipping Systems

• Precise control of dispensing pressure and time

• Syringes can be selected according to demand

• Can be dispensed with glue or solder paste

Visual Correction System

• High-speed image processing unit

• Configurable algorithms for different scenarios

• Easy operation

Quick-change system for suction tips

• Automatic quick-change tips

• Optional 4 or 14 tips

• Configuration calibration tips

Product Pick & Place System

• Suitable for a wide range of dies and other components

• Suitable for a wide range of feed types

• Compatible with different carriers