3D Wire Bonding Defect AOI Equipment
• The equipment is suitable for visual AOI inspection of IGBT modules after bonding.
• Suitable for primary and secondary tying
• Applicable incoming production mode: on-line/magazine/tray type.
• Optical inspection is in high precision 2D+3D mode.
• With MES communication function.
• The equipment uses dust-free materials to meet the requirements for use in clean workshops.
• The equipment is equipped with plasma cleaning mechanism.
• Identify the product/carrier with a QR code and bind the test results.
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