Fully Automated Pre-sintering Equipment
• Mounting accuracy: ±10μm@3s；±0.5°@3s
• Bond force: 0.1~30kg
• UPH up to 950pcs ( (single die take+photo+put+heat))
• Compatible with pressure silver paste and pressure paste film process
• Flexible compatibility with 6″, 8″wafer mounting（12″ Optional）; Small footprint
• Substrate heating: room temperature~300°
• Meet the protocols of SECS/GEM and support MES interfacing
• Modular design allows customers to configure the modules they need according to their process requirements
沪公网安备 31011202005670号