• Automates Die pickup, handling, testing and unloading
• Dies support wafer, waffle box and other loading and unloading forms. Each test station is individually configured for defective goods receiving station.
• Support for dynamic, static, avalanche and other different functional tests
• Supports 4 stations in series and parallel testing, different stations support different temperatures and test items
• UPH (4 test benches, serial measurement) 1000pcs (test time counted as 1s)
• Placement accuracy ≤±30μm
• Supports high-temperature testing from room temperature to 200°C
• Chuck is hermetically sealed, nitrogen-protected and anti-high-pressure ignition
• Supports six-side appearance inspection function
• Universal module interface, fast assembly and disassembly, high scalability